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This is the free Material Data Center Datasheet of Ultrason® S 6010 NAT - PSU - BASF

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제품 설명서
Unreinforced, higher viscosity grade, tougher and with improved chemical resistance.
Abbreviated designation according to ISO 1043-1: PSU
Processing/Physical Characteristics건조/응축단위시험규격
ISO 데이터
용융 부피 - 흐름 속도, MVR 30 / * cm³/10min ISO 1133
온도 360 / * °C -
하중 10 / * kg -
성형 수축률, 평행 0.7 / * % ISO 294-4, 2577
성형 수축률, 수직 0.8 / * % ISO 294-4, 2577
기계적 특성건조/응축단위시험규격
ISO 데이터
인장탄성률 - / 2550 MPa ISO 527
항복강도 - / 75 MPa ISO 527
항복변형률 - / 5.7 % ISO 527
챠피 충격 강도 , +23°C - / N kJ/m² ISO 179/1eU
챠피 충격 강도, -30°C - / N kJ/m² ISO 179/1eU
챠피 노치드 충격 강도, +23°C - / 6 kJ/m² ISO 179/1eA
챠피 노치드 충격 강도, -30°C - / 6.5 kJ/m² ISO 179/1eA
ASTM 데이터
항복강도 75.2 / - MPa ASTM D 638
항복변형률 5.7 / - % ASTM D 638
굴곡 계수 2599 / - MPa ASTM D 790
굴곡 강도 114 / - MPa ASTM D 790
아이조드 충격은 노치, 1/8 in 10 / - J/m ASTM D 256
열적 특성건조/응축단위시험규격
ISO 데이터
유리 전이 온도, 10 °C/min 187 / * °C ISO 11357-1/-2
하중하에서의 변형온도, 1.80 MPa 177 / * °C ISO 75-1/-2
하중하에서의 변형온도, 0.45 MPa 183 / * °C ISO 75-1/-2
선형 열팽창 계수, 평행 53 / * E-6/K ISO 11359-1/-2
ASTM 데이터
DTUL @ 66 psi 182 °C ASTM D 648
DTUL @ 264 psi 172 °C ASTM D 648
전기적 특성건조/응축단위시험규격
ISO 데이터
상대 유전율, 100Hz - / 3.5 - IEC 62631-2-1
상대 유전뮬, 1MHz - / 3.4 - IEC 62631-2-1
소산 인자, 100Hz - / 11 E-4 IEC 62631-2-1
소산 인자, 1MHz - / 71 E-4 IEC 62631-2-1
부피 저항 - / >1E13 Ohm*m IEC 62631-3-1
표면 저항 * / >1E15 Ohm IEC 62631-3-2
전기 압력 - / 37 kV/mm IEC 60243-1
CTI - / 125 - IEC 60112
기타 특성건조/응축단위시험규격
물에서의 흡수성 0.8 / * % ISO 62와 유사
조건에서의 흡습성 0.3 / * % ISO 62와 유사
밀도 1230 / - kg/m³ ISO 1183
밀도 1240 kg/m³ ASTM D 792
물질의 비성질건조/응축단위시험규격
ISO 데이터
점도수 81 / * cm³/g ISO 307, 1157, 1628
Processing Recommendation Injection Molding단위시험규격
Pre-drying - Temperature 140 °C -
Pre-drying - Time 4 h -
Processing humidity ≤0.02 % -
용융수지온도 330 - 390 °C -
성형온도 120 - 160 °C -
특징
생산 공정
사출 성형, 외형 압출, 시트 압출, 중공 성형, 열성형
인도 유형
펠렛 (입자,알갱이), 자연 색상
지역별 검색
기타 정보
사E성
PREPROCESSING
Pre/Post-processing, max. allowed water content: .02 %
Pre/Post-processing, Pre-drying, Temperature: 140 °C
Pre/Post-processing, Pre-drying, Time: 4 h

PROCESSING
injection molding, Melt temperature, range: 330 - 390 °C
injection molding, Melt temperature, recommended: 350 °C
injection molding, Mold temperature, range: 120 - 160 °C
injection molding, Mold temperature, recommended: 140 °C
injection molding, Dwell time, thermoplastics: 10 min

Pretreatment
Drying temperature: 130 - 150°C
Drying time: minimum 4h
recommended dryer: vaccum or dry air dryer
maximum moisture: 0,02 - 0,05%

Ultrason® can be injection molded by any type of machinery on the market, provided that the plasticizing unit and the mold temperature control system have been configured appropriately. The machinery manufacturer must be consulted if any doubts exist on the ability of various parts to withstand the high temperatures required (e.g. barrel, barrel head, bolted connections, etc.)

Long residence time in combination with high temperatures should be avoided e.g. by pump out material at regular intervals.
During extended interruptions, the barrel temperature should be lowered to about 250-280°C.

It has been found out that heating to the requested processing temperature and shutting down or lowering the temperature is best carried out in two steps.
First, the barrel temperatures are set at the lower processing temperature range for the particular thermoplastic (340 - 350 °C). As soon as these temperatures have reached a steady state, the material in the barrel is pumped out. Second, the barrel temperature can be set to the required processing temperature or the heaters can be shut down.
Disclaimer
Copyright Altair Engineering GmbH. Altair Engineering GmbH assumes no liability for the system to be free of errors. The user takes sole responsibility for the use of this data under the exclusion of every liability from Altair Engineering GmbH; this is especially valid for claims of compensation resulting from consequential damages. Altair explicitly points out that any decision about the application of materials must be double checked with the producer of this material. This includes all contents of this system. Copyright laws are applicable for the content of this system.
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